“Samsung Electronics, a world leader in advanced semiconductor technology, today announced the launch of its latest premium application processor (AP), the Exynos 9 Series 8895. This is Samsung’s first processor chipset to take advantage of the most advanced and industry leading 10-nanometer (nm) FinFET process technology with improved 3D transistor structure, which allows up to 27% higher performance while consuming 40% less power when compared to 14nm technology. The new Exynos 9 Series 8895 is the first processor of its kind to embed a gigabit LTE modem that supports five carrier aggregation, or 5CA. It delivers fast and stable data throughput at max.1Gbps (Cat.16) downlink with 5CA and 150Mbps (Cat.13) uplink with 2CA.”