Content for Hardware

NVIDIA Sets Path for Future of Edge AI and Autonomous Machines With New Jetson AGX Orin Robotics Computer

“NVIDIA today introduced NVIDIA Jetson AGX Orin™, the world’s smallest, most powerful and energy-efficient AI supercomputer for robotics, autonomous machines, medical devices and other forms of embedded computing at the edge. Built on the NVIDIA Ampere architecture, Jetson AGX …

NXP’s i.MX 93 Applications Processor Family Powers a New Era of Secure Edge Intelligence

“NXP Semiconductors (NASDAQ: NXPI) today announced the i.MX 93 family of applications processors designed for automotive, smart home, smart building and smart factory applications, which leverage edge machine learning to anticipate and automate based on user needs. As the …

Panasonic Develops World’s First Near Field Communication Technology Using Wavelet OFDM

“Panasonic Corporation today announced that it has developed a secure near field communication technology (hereinafter, “PaWalet Link”) using a loop antenna by applying Wavelet OFDM*2 to a communication method using a magnetic field. As a result, it is possible …

Renesas Expands 5G mmWave Beamformer Portfolio with Industry-Leading Transmitter Output Power Capability

“Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today expanded its 5G beamformer IC family with two new dual-polarization mmWave devices optimized for 2x2 antenna architecture for 5G and broadband wireless applications with best-in-class performance at …

Renesas Expands Lineup of 28nm Cross-Domain Automotive Control Microcontrollers

“Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today introduced a powerful new group of microcontrollers (MCUs), the RH850/U2B MCUs, designed to address the growing need to integrate multiple applications into a single chip and realize a …

Renesas Unveils New Multi-Cell Battery Front End Family for High-Cell Count, High-Voltage Systems

“Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today introduced a new family of multi-cell full battery front end (BFE) ICs for battery management systems (BMS) built for the larger, high-voltage battery packs that power e-scooters …

Samsung Develops Industry’s First LPDDR5X DRAM

“Samsung’s LPDDR5X DRAM will provide over 1.3x faster processing speeds and consume nearly 20% less power than the previous LPDDR5 solution The LPDDR5X solution will broaden the use of high-performance, low-power memory beyond smartphones to AI and edge …

STMicroelectronics’ Port-Protection IC for STM32 MCUs Tailored to USB-C Dual-Role Power

“The STMicroelectronics TCPP03-M20 USB Type-C port-protection IC is tailored for Dual-Role Power (DRP) applications, simplifying the design of products that can act as a power source for connected devices as well as accepting power from other USB-C sources …

TSMC to Build Specialty Technology Fab in Japan with Sony Semiconductor Solutions as Minority Shareholder

“TSMC (TWSE: 2330, NYSE: TSM) and Sony Semiconductor Solutions Corporation (“SSS”) today jointly announced that TSMC will establish a subsidiary, Japan Advanced Semiconductor Manufacturing, Inc. (“JASM”), in Kumamoto, Japan to provide foundry service with initial technology of 22/28-nanometer processes …

New buck/boost converter maintains industry’s lowest IQ while integrating supercapacitor charging

“Engineers can extend battery life by up to 20% in low-power industrial applications with new DC/DC converter from TI Texas Instruments (TI) (Nasdaq: TXN) today introduced a new bidirectional buck/boost converter with an ultra-low quiescent current (IQ) of …