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News Toshiba’s Newly Launched 1200V and 1700V Silicon Carbide MOSFET Modules will Contribute to Smaller, More Efficient Industrial Equipment
“Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched two silicon carbide (SiC) MOSFET Dual Modules: “MG600Q2YMS3,” with a voltage rating of 1200V and drain current rating of 600A; and “MG400V2YMS3,” with a voltage rating of 1700V and drain current rating …
News MediaTek Shows The World’s First Live Demos of Wi-Fi 7 Technology to Customers and Industry Leaders
“MediaTek leads in pervasive wireless connectivity with advanced Filogic Wi-Fi 7 technology. MediaTek today announced the world’s first live demo of Wi-Fi 7 technology, highlighting the capabilities of its forthcoming Wi-Fi 7 Filogic connectivity portfolio. MediaTek is currently showcasing …
News Panasonic Develops MEGTRON 8 Multi-Layer Circuit Board Materials Featuring Low Transmission Loss for High-Speed Communication Networking Equipment
“Panasonic Corporation announced today that its Industry Company has developed MEGTRON 8[1] Multi-Layer Circuit Board Materials Featuring Low Transmission Loss [2], designed for high-speed communication networking equipment such as routers and switches. The worldwide deployment of the fifth-generation mobile …
News Samsung Introduces Game Changing Exynos 2200 Processor With Xclipse GPU Powered By AMD RDNA 2 Architecture
“The new premium mobile processor comes with hardware-accelerated ray tracing and state of the art Arm-based processing technology Samsung Electronics, a world leader in advanced semiconductor technology, today announced its new premium mobile processor, the Exynos 2200. The Exynos 2200 …
News STMicroelectronics Brings Ease and Flexibility to USB Power Delivery with Digitally Programmable Synchronous Buck Converter
“Featuring a synchronous topology for optimum efficiency, the STMicroelectronics STPD01 DC/DC buck converter is digitally programmable for USB Power Delivery (PD) applications up to 60W. With a wide input-voltage range of 6V to 26.4V, the STPD01 offers flexibility …
“Test and measurement engineers can save months of design time by eliminating the need for custom ASICs and simplifying front-end designs Texas Instruments (TI) (Nasdaq: TXN) today introduced the industry’s widest-bandwidth high-input-impedance (Hi-Z) buffer amplifier, capable of supporting frequency …
News Micron Ships the Industry’s First 176-Layer QLC NAND in Volume and Unveils the 2400 PCIe Gen4 Client SSD
“Micron Technology, Inc. (Nasdaq: MU), today announced it has begun volume shipments of the world’s first 176-layer QLC NAND SSD. Built with the most advanced NAND architecture, Micron’s 176-layer QLC NAND delivers the industry’s leading storage density …
News Toshiba Expands Line-up of Ethernet Bridge ICs for Automotive Information Communications Systems and Industrial Equipment
“Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has added “TC9563XBG” to its line-up of Ethernet bridge ICs, to provide support for 10Gbps communications in automotive information communications systems and industrial equipment. Sample shipments have started and volume production will start in …
“Today at CES 2022, Intel launched 12th Gen Intel® Core™ processors (code-named Alder Lake S-series and H-series), the first family of processors enhanced for the edge to feature performance hybrid architecture that combines Performance-cores and Efficient-cores with Intel® Thread Director …
News AMD Unveils New Power-Efficient, High-Performance Mobile Graphics for Premium and Thin-and-Light Laptops, and New Desktop Graphics Cards
“Today, during the 2022 Product Premiere livestream event, AMD (NASDAQ: AMD) unveiled additions and enhancements to the AMD Radeon™ graphics portfolio to deliver incredible, next-level experiences to more gamers than ever. Bringing higher levels of performance to power a new …