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“STMicroelectronics’ L9908 integrated automotive three-phase gate driver unit (GDU) operates in 12V, 24V, or 48V systems and has flexible input and output channels to fulfil numerous applications in conventional and hybrid/electric vehicles. Dedicated source connections to the high-side and …
“Intel today announced full details and availability for the new 12th Gen Intel® Core™ i9-12900KS, the world’s fastest desktop processor1. It delivers up to 5.5 GHz max turbo frequency — in spec with Intel® Thermal Velocity Boost and …
“The first Intel Arc A-Series graphics processing units will power laptops, with more products coming this year for desktops and workstations. For decades, Intel has been a champion for PC platform innovation. We have delivered generations of CPUs that provide …
“Announcing a new secure storage subsystem and key provisioning for the Wireless Power Consortium (WPC) Qi 1.3 Wireless Charging standard. In order to ensure high quality wireless charging power transmitters, the Wireless Power Consortium (WPC) has released the Qi …
News Toshiba Releases 150V N-channel Power MOSFET that Uses Latest Generation Process to Improve Power Supply Efficiency
“Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched a 150V N-channel power MOSFET “TPH9R00CQH” that uses the latest generation process, “U-MOSX-H,” and that is suitable for use in switching power supplies for industrial equipment—including those deployed in …
News 3rd Gen AMD EPYC Processors with AMD 3D V-Cache Technology Deliver Outstanding Leadership Performance in Technical Computing Workloads
“AMD (NASDAQ: AMD) announced the general availability of the world’s first data center CPU using 3D die stacking, the 3rd Gen AMD EPYC™ processors with AMD 3D V-Cache™ technology, formerly codenamed “Milan-X.” Built on the “Zen 3” core architecture …
“Today, Intel contributed the Scalable I/O Virtualization (SIOV) specification to the Open Compute Project (OCP) with Microsoft, enabling device and platform manufacturers access to an industry standard specification for hyperscale virtualization of PCI Express and Compute Express Link devices …
“Nexperia, the expert in essential semiconductors, today announced the release of new, enhanced Electrothermal models for its MOSFET devices. Semiconductor manufacturers commonly provide simulation models for their MOSFETs, but these usually only include a limited number of device parameters which …
“Intel has published the most significant update to industry power supply specifications since the initial ATX 2.0 specs were introduced in 2003. Updated ATX 3.0 specifications unlock the full power and potential of next-generation hardware and upcoming components …
News onsemi Unveils New High Power Totem Pole PFC Controller Meeting Challenging Efficiency Standard
“onsemi (Nasdaq: ON), a leader in intelligent power and sensing technologies, introduced its latest mixed-signal controller dedicated to bridgeless totem pole PFC (TP PFC) topology. The NCP1681 targets ultra-high density offline power supplies. Building upon the success of theNCP1680, which …