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“High-efficiency switching with reduced spiking now in LFPAK56 and LFPAK88 Nexperia, the essential semiconductor expert, today announced a broadening of package options for its NextPower 80/100 V MOSFETs portfolio, previously only available in LFPAK56E, to now also include LFPAK56 …
News STMicroelectronics reveals integrated hot-swap and ideal-diode controller for automotive safety-critical applications up to ASIL-D
“The STMicroelectronics STPM801 is the market’s first automotive-qualified integrated hot-swap and ideal-diode controller featured for functional-safety applications. The ideal-diode controller drives an external MOSFET replacing a Schottky diode conventionally used for reverse-input protection and output-voltage holdup. The reduced voltage …
“Microchip’s 5071B is a compact commercial timing product offering ease of deployment across multiple industries. From everyday applications such as mobile phones and banking to complex underwater defense missions, the need for synchronized precise timing and frequency solutions is …
News Nordic Semiconductor expands nRF70 Series with nRF7001 Wi-Fi 6 Companion IC for cost-optimized designs
“14Jun 2023Oslo, Norway Product nRF7001 Wi-Fi Connected Health Connected Home Industrial Automation Logistics and smart transportation Retail and Payment Top Story nRF7001 The nRF7001 IC offers a low-cost Wi-Fi 6 solution for low power Wi-Fi IoT products requiring 2.4 …
News Toshiba Launches Motor Driver ICs with Small Package and Reduced External Parts that Save Space on Circuit Boards
“Toshiba Electronic Devices & Storage Corporation (“Toshiba”) has launched motor driver ICs for consumer and industrial equipment that need fewer external parts and that are housed in a small, highly versatile, space saving package. The launch expands Toshiba lineup with four …
“NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled RF amplifier modules, based on a packaging innovation designed to enable thinner and lighter radios for 5G infrastructure. These smaller base stations can be more easily and cost-effectively installed …
“Today, Intel introduced the Intel® Arc™ Pro A60 and Pro A60M as new members of the Intel® Arc™ Pro A-series professional range of graphics processing units (GPUs). The new products are a significant step up in performance in the Intel …
News Microchip Slashes Time to Innovation with Industry’s Most Power-Efficient Mid-Range FPGA Industrial Edge Stack, More Core Library IP and Conversion Tools
“The new imperatives of the intelligent edge – power efficiency, security and reliability – are forcing system architects and design engineers to find new solutions. For the growing number of system designers switching to PolarFire FPGAs and SoCs, Microchip Technology Inc. (Nasdaq …
“Intel is the first in the industry to implement backside power delivery on a product-like test chip, achieving the performance needed to propel the world into the next era of computing. PowerVia, which will be introduced on the Intel 20A …
News Samsung’s Exynos Auto V920 To Power Hyundai Motor’s Next-Generation In-Vehicle Infotainment Systems
“Samsung Electronics, a world leader in advanced semiconductor technology, today announced that its latest automotive processor, the Exynos Auto V920, has been selected to power Hyundai Motor Company’s next-generation in-vehicle infotainment (IVI) systems, which are expected to roll out …